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課程名稱 |
高科技廠房設施營建
High Tech Facility Construction Management |
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開課學期 |
105-2 |
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授課對象 |
工學院 結構工程組 |
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授課教師 |
張陸滿 |
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課號 |
CIE7139 |
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課程識別碼 |
521EM7270 |
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班次 |
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學分 |
3.0 |
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全/半年 |
半年 |
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必/選修 |
選修 |
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上課時間 |
星期三7,8,9(14:20~17:20) |
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上課地點 |
土研402 |
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備註 |
本課程以英語授課。與莊子壽合開
限學士班三年級以上
總人數上限：34人 |
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Ceiba 課程網頁 |
http://ceiba.ntu.edu.tw/1052CIE7139_CE7270 |
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課程簡介影片 |
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核心能力關聯 |
核心能力與課程規劃關聯圖 |
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課程大綱
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為確保您我的權利,請尊重智慧財產權及不得非法影印
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課程概述 |
The course will be taught in English. Students are encouraged to use English for asking questions and answering homework problems. However, to enhance student's learning and to facilitate the communication between instructor and students, manderin could be used in the case. Students could shift to the English version of this course for detail contents.
Basically, the purpose of this course is to provide basic knowledge needed for managing a constructed project of high-tech facility. High-Tech includes, not limited to, the advanced technologies applied in the fields of microelectronics, optoelectronics, precision equipment, telecommunication, nanotech, pharmaceutics, biotech, medical devices, animal experiment, and Aerospace. The construction processes undertaken in high-tech manufacturing plants require
special clean-build protocols with extremely tight schedule, stringent quality and safety control as well as effective communication for integrating all the participants. The students will learn and experience the processes.
The focus of this course is on managing high-tech plant construction and engineering its facilities for life-cycle operation. Students will gain methodologies needed to meet ever-changing challenge of delivering an ultra-pure and fast moving semiconductor and related Fabs such as wafer, LED, TFT, and/or Photovoltaic. Moreover, this course will strengthen student’s understanding and background in managing high-tech fab engineering project and integrating its interdisciplinary nature.
This course is intended to offer to both graduate students and undergraduate seniors. Students in engineering, science, pharmacy, and life science will be exposed to fundamental theories and their applications in build/certify/manage the high tech manufacturing plants. Academic faculty will teach basic theories and principles. Professional industrial experts will be invited to cover the application of theories and principles in the real world practices. The contents will include lectures, home works, a semester team project with an oral presentation and a written report, and a final examination. Field trips to visit high-tech plants and research labs, and cleanrooms will be arranged.
Moreover, laboratory experiments will be required to enable students to have hands-on experiences on cleanroom testing. And a short supplemental course by applying TSMC’s 3D CAD to Fab Project Management may be provided on a volunteer base, if more than 10 students sign up for the short course,the supplemental course will be examined and certified by TSMC 300mm Fabs Facility Division.
The following YouTube exemplifies the 5D wafer Fab:
https://youtu.be/hnuczt8Vxb4
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課程目標 |
1.Differentiate the typical processes in IC, Photovoltaic and
Bio-medical Fabs.
2.Explain the interdisciplinary nature of high tech Fab construction
3.Perform Site Investigation & Mobilization.
4.Use the basic theories and principles to control Fab Design/Build schedule, to integrate time with cost and to perform cost-time trade off.
5.Classify cleanrooms in terms of various international standards.
6.Measure and verify cleanroom.
7.Establish clean-build protocols for constructing and renovating the clean room and other high-tech facilities.
8.Address the issues in automatically integrating the emergency, safety, and security systems.
9.Link to the information sources for further studies in nano/micro fabrication and research.
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課程要求 |
There will be approximate 5~8 home works in spring 2016. Homework counts 20% of “Total Grade.” Students will have to preview class reading assignments. The homework is to answer the questions derived from the reading assignments, lectures, lab experiments, cleanroom tour, or field trips.
There is one (1) group term project. The group term project will be related to high-tech facility and construction management. The term project tests the student's understanding of the principal managerial concepts covered in the course within the context of a comprehensive “real-world” problem. It also provides an opportunity to develop skills for working in a project team context and communication skills. The term project counts 50% of the final grade.
A Final Exam is required on June 22, 2016. The Final Exam will be comprehensive and counted as 15% of “Total Grade.” Group Field Trip Reports (Group work- 3% and Individual work-2%) and another 10% is for class participation.
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預期每週課後學習時數 |
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Office Hours |
另約時間 |
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指定閱讀 |
The following textbooks can be accessed and downloaded from NTU Library Website. Since only a few chapters will be assigned from each textbook, students are not required to purchase them.
1. Whyte, W., Cleanroom Technology, John Wiley, New York 2001
2. Whyte, W., Cleanroom Design, John Wiley, 2nd ed., New York 1999
3. Van Zant, Peter, Microchip Fabrication: A Practical Guide to Semiconductor Processing, 6th ed., McGraw-Hill, New York, 2014
4. IEST Publications
5. In Class Handouts |
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參考書目 |
1.Chang, C.Y., and Sze, S.M., ULSI Technology, McGraw-Hill Company, Inc., International Edition, 1996, New York.
2.Clifford J. Schexnayder and Richard E. Mayo, Construction Management Fundamentals, McGraw-Hill, New York, 2003, International Edition
3.Food and Drug Administration, Guideline on Sterile Drug Products Produced by Aseptic Processing, FDA, Information Branch, Rockville, Maryland, USA.
4.International Organization for Standards, ISO Standard 14644-4, part 4: Design, Construction, Start up, Geneva, Switzerland, 1999.
5.International Society of Pharmaceutical Engineering, Pharmaceutical Engineering Guide – A Guide for New Facilities, Volume 3: Sterile Manufacturing Facilities, ISPE, 2000.
6.Lurgi, S., Xu, J., and Zaslavsky, A., Future Trends in Microelectronics, Wiley, N.Y, 1999.
7.Mulhall, D., Our Molecular Future: How Nanotechnology, Robotics, Genetics, and Artificial Intelligence Will Transform Our World, Prometheus Books, Amherst, N.Y., 2002.
8.Nishi, Y., Doering, K., and Wooldridge, T., Handbook of Semiconductor Manufacturing Technology, Marcel Dekker, New York, 2000.
9.Oberlender, G. D. Project Management for Engineering and Construction, 2nd Edition, McGraw-Hill, 2000.
10.Project Management Institute (PMI), “A Guide to the Project Management Body of Knowledge,” Newtown Square, PA, USA, 2004.
11.Scherge, M., Biological Micro- and Nanotribiology: Nature’s Solutions, Sprinker, New York, 2001.
12.Van Zant, Peter, Microchip Fabrication: A Practical Guide to Semiconductor Processing, 4th ed., McGraw-Hill, New York, 2000.
13.Whyte. W., Cleanroom Technology: Fundamentals of Design, Testing, and Operation Operation, Chichester, New York, 2001.
14.半導體製造技術，Quirk Serda 著，羅文雄、蔡榮輝 譯 ，滄海（2003）
15.半導體奈米技術，龍文安 著，五南(2006)
16.半導體英語，傳田精一 著，陳連春 譯，建興(2003)
17.高科技廠務，顏登通，全華科技(2008)
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評量方式
(僅供參考) |
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週次 |
日期 |
單元主題 |
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第1週 |
2/22 |
Course Introduction and Overview of High-Tech Facility Construction Management |
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第2週 |
3/01 |
Fundamentals of Project Management and CPM Scheduling |
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第3週 |
3/08 |
Time-Cost Integration and Floats Management |
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第4週 |
3/15 |
Scheduling Thru Microsoft Project, Planning of Nanoscale Science and Technology Facilities and Nanotechnology Safety |
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第5週 |
3/22 |
Introduction of Group Project, Each Facility System and TSMC 5D Model Demonstration |
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第6週 |
3/29 |
Fundamentals of Nanotechnology, Semiconductor, Integrated Circuit and Manufacturing Processes (CMOS, FinFET and 3DIC) |
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第7週 |
4/05 |
Memorial Holidays for Ancestors- No Class |
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第8週 |
4/12 |
Economics & Profitability of Wafer Manufacturing Industry
Construction Safety Program and Quality Management
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第9週 |
4/19 |
No Mid-term Exam, but, Substituted with a 2-day Mandatory Field Trip to TSMC Fab15 at Taichung on 5/20 & 5/21
5/20, TSMC Fab15, Taichung
Tour Fab15 Green Facilities
Cost-Effective Management of Fab Operation
Experiments on Electrical, Chemical and Ultrapure Water Systems
5/20 Night, Staying in Taichung,
5/21, TSMC Fab15, Taichung
Tour TSMC Fab15-P7 Construction Site for Sub-structure and Super-structure.
Demonstration of TSMC 5D Simulation and Fab Management Control System.
5D Scheduling Presentation of Each Group, Integration of Each Group’ System and Sponsors Input |
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第10週 |
4/26 |
Construction Management on MEP Systems and Cleanroom Construction Methods, Protocols, and Tests. |
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第11週 |
5/03 |
Intelligent Fab, Green Manufacturing, and Construction Waste Management and Corporate Social Responsibility |
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第12週 |
5/10 |
Operation Management on Process Gases and Chemicals, Ultra-Pure Water and Bulk Gas plant |
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第13週 |
5/17 |
TFT-LCD Manufacturing and EHS |
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第14週 |
5/24 |
Resource Leveling, Methods of Shortening Project Duration, Principle and Application Program Evaluation Review Technology (PERT) and Risk Management |
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第15週 |
5/31 |
5D Term Project Scenario Analysis and Integration |
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第16週 |
6/07 |
Project Delivery Methods and Total Quality Management |
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第17週 |
6/14 |
Group Final Term Project Presentation |
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