課程名稱 |
半導體微感測器設計與測試 CMOS-MEMS Sensor Design, Testing and Evaluation |
開課學期 |
104-2 |
授課對象 |
工學院 應用力學研究所 |
授課教師 |
黃榮山 |
課號 |
AM7172 |
課程識別碼 |
543 M5350 |
班次 |
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學分 |
3 |
全/半年 |
半年 |
必/選修 |
選修 |
上課時間 |
星期三7,8,9(14:20~17:20) |
上課地點 |
應107 |
備註 |
本課程中文授課,使用英文教科書。 總人數上限:12人 |
Ceiba 課程網頁 |
http://ceiba.ntu.edu.tw/1042AM7172_ |
課程簡介影片 |
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核心能力關聯 |
核心能力與課程規劃關聯圖 |
課程大綱
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課程概述 |
半導體微感測器設計與測試
CMOS-MEMS Sensor Design, Testing and Evaluation
Spring, 2016
Class Schedule: Wednesday, 2:20pm-5:20pm at Room 107, 應力館
Instructor: 黃榮山 (Long-Sun Huang),
應力館Room 419 (02-3366-5653)
Office Hour: appointment by email (Prof. Huang)
References:
1. M. Madou, Foundamentals of Microfabrication, 1997 (CRC Press).
2. G.T.A. Kovacs, Micromachined Transducer Sourcebook, 1998S. D. Senturia, Microsystem Design, 2001 (Kluwer Academic publishers)
3. 莊達人, VLSI 製造技術, 1995 (高立圖書有限公司)
4. S.M. Sze, VLSI Technology, 2nd ed., 1988 (McGraw Hill).
Course Description:
The integration of MEMS technology with the mainstream CMOS technology is referred to as CMOS-MEMS technology. The use of CMOS-MEMS technique has been increasingly accepted in foundry semiconductor industry to create miniaturized sensors, actuators, and structures such as accelerometers, microphone, gyro sensor, electronic compass, and micro resonators. Thanks to this enabling technique and unique advantages offered by foundry semiconductor incorporations in Taiwan, the CMOS-MEMS sensors (microcantilever sensor, etc.) can be realized in class to allow students for hands-on operation, packaging, parameter testing, and device functional evaluation. This course is interdisciplinary nature of micromachining techniques and their applications. In addition to the micro science and sensor-oriented engineering lecture, the course will also provide lab project for simplified hands-on experiments to gain practical sense of foundry CMOS-MEMS micro sensors.
核心能力關聯
博士班
1. 力學與相關領域之專業知識與技術,以及運用數學、科學及工程知之能力。
2. 獨立思考、創新、設計工程系統、元件及製程之能力。
3. 策劃及執行專題研究、撰寫技術報告及論文之能力。
4. 設計與執行工程實務、進行實驗以及分析與解釋數據之能力
碩士班
1. 力學與相關領域之專業知識與技術,以及運用數學、科學及工程知識之能力。
2. 獨立思考、創新、設計工程系統、元件及製程之能力。
3. 策劃及執行專題研究、撰寫技術報告及論文之能力。
4. 設計與執行工程實務、進行實驗以及分析與解釋數據之能力。
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Course Outline
Date Topics Lab Lab
Assignment
(1) Fabrication Lecture
Wk 1 Introduction, Schedule, Policies, documents (NDA form, CIC registration, etc)
Wk 2 CMOS-MEMS processes
(TSMC 2P4M |
課程目標 |
The integration of MEMS technology with the mainstream CMOS technology is referred to as CMOS-MEMS technology. The use of CMOS-MEMS technique has been increasingly accepted in foundry semiconductor industry to create miniaturized sensors, actuators, and structures such as accelerometers, microphone, gyro sensor, electronic compass, and micro resonators. Thanks to this enabling technique and unique advantages offered by foundry semiconductor incorporations in Taiwan, the CMOS-MEMS sensors (microcantilever sensor, etc.) can be realized in class to allow students for hands-on operation, packaging, parameter testing, and device functional evaluation. This course is interdisciplinary nature of micromachining techniques and their applications. In addition to the micro science and sensor-oriented engineering lecture, the course will also provide lab project for simplified hands-on experiments to gain practical sense of foundry CMOS-MEMS micro sensors. |
課程要求 |
MEMS introduction or related courses pre-required. |
預期每週課後學習時數 |
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Office Hours |
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指定閱讀 |
待補 |
參考書目 |
1. M. Madou, Foundamentals of Microfabrication, 1997 (CRC Press).
2. G.T.A. Kovacs, Micromachined Transducer Sourcebook, 1998.
3. S. D. Senturia, Microsystem Design, 2001 (Kluwer Academic publishers)
4. 莊達人, VLSI 製造技術, 1995 (高立圖書有限公司)
5. S.M. Sze, VLSI Technology, 2nd ed., 1988 (McGraw Hill).
6. 晶片設計實作課程-CMOS MEMS 晶片實作與感測電路IP整合, 國家晶片系統設計中心,2016.
7. Full-custom IC Design Concepts, Training Manual, 國家晶片系統設計中心,2016.
8. In-class lecture material & reference papers
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評量方式 (僅供參考) |
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週次 |
日期 |
單元主題 |
第1週 |
2/24 |
Introduction, Schedule, Policies, documents (NDA form, CIC registration, signature, ...etc) |
第2週 |
3/02 |
CMOS-MEMS processes (TSMC 2P4M, 1P6M) + cleanroom visit (lecture +visit) |
第3週 |
3/09 |
Sensor I (accelerometer, pressure sensor, etc.)(lecture) |
第4週 |
3/16 |
Sensor II-1 (Biosensor)(lecture) |
第5週 |
3/23 |
Sensor II-2 (Biosensor) (lecture) |
第6週 |
3/30 |
sensor I-Commercial accelerometer (lecture+lab) |
第7週 |
4/06 |
CMOS-MEMS cadence software (lecture+lab) |
第8週 |
4/13 |
CMOS-MEMS cadence software (lecture+lab) |
第9週 |
4/20 |
PCB Introduction/Industry/supply chain (lecture) |
第10週 |
4/27 |
PCB assembly and associated technqies (lecture) |
第11週 |
5/04 |
PCB Layout design and Fabrication, Wire bond visit (lab) |
第12週 |
5/11 |
true device release, microscopic view / packaging/testing: Wheaston bridge circuitry,Device, Filter, AMPx2, PCB & Wire Bonding(lab) |
第13週 |
5/18 |
Piezoresistance coefficients(Gauge factor) (lecture+lab) |
第14週 |
5/25 |
TCR, and thermal expansion coeff. (lecture + lab) |
第15週 |
6/01 |
Young’s modules measurements (lecture + lab) |
第16週 |
6/08 |
In-class Mask layout + Design (Case: cantilever/membrane/thermal...) |
第17週 |
6/15 |
File: DRC,Mask file, coventorware file |
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