課程資訊
課程名稱
半導體電子產品工程
Semiconductor Electronic Product Engineering 
開課學期
108-2 
授課對象
電機資訊學院  電機工程學研究所  
授課教師
潘正聖 
課號
EEE5054 
課程識別碼
943 U0560 
班次
 
學分
3.0 
全/半年
半年 
必/選修
選修 
上課時間
星期三6,7,8(13:20~16:20) 
上課地點
電二141 
備註
總人數上限:12人 
Ceiba 課程網頁
http://ceiba.ntu.edu.tw/1082EEE5054_ 
課程簡介影片
 
核心能力關聯
核心能力與課程規劃關聯圖
課程大綱
為確保您我的權利,請尊重智慧財產權及不得非法影印
課程概述

Semiconductor electronic product engineering techniques, covering knowledge in process, device, circuit design, test, Q/R etc., as well as the teamwork among domain specialists to drive for product success. 

課程目標
1. Product engineering is to ensure product characteristics meeting specifications and classify individual unit accordingly.
2. If there is any product behavior failing specification, product engineer must understand the failure root cause and identify & implement solution by collaborating with device/process, design, testing, and quality/reliability.
3. Technical background is very broad covering from process, device and design, since product failure may be caused by any anomaly in either design or process/device. Solutions may come from both sides.
4. The key performance index of product engineering is yield, which is tied closely to business success.
In short, product engineering requires multi-disciplinary knowledge in order to be successful 
課程要求
需有電子學、半導體製程或半導體元件物理等相關基礎 
Office Hours
另約時間 備註: 請學生先和老師聯絡,並確定時間/地點 
參考書目
1. VLSI Technology, 2nd edition by S. Sze
2. Physics of Semiconductor Devices, 2nd edition by S. Sze
3. VLSI Test Principles and Architectures, edited by LT Wang, CW Wu and XQ Wen,
2006 *
4. System on Chip Test Architectures, edited by LT Wang, CE Stroud and NA
Touba, 2008 *
5. Applied Reliability, 3rd edition by P. Tobias
6. Reliability Physics and Engineering, 2nd edition by J. W. McPerson
7. Intel Quality Handbook, 2014 *
8. Renesas Semiconductor Reliability Handbook, 2017 *

* Some material in these references as well as the lecturer's past experiences
will be covered 
指定閱讀
Digital Integrated Circuits: A Design Perspective, 2nd edition by Jan M. Rabaey 
評量方式
(僅供參考)
 
No.
項目
百分比
說明
1. 
期中考 
50% 
個別口試一小時 
2. 
期末專題書面暨口頭報告 
50% 
專題主題需先得到老師同意 
 
課程進度
週次
日期
單元主題
第1週
3/04  Semiconductor electronics product engineering overview, Ch 1 
第2週
3/11  Overview of process/device technology, Ch 2-3 
第3週
3/18  Q&R fundamentals and process/product qualification fundamentals, HBs 
第4週
3/25  Wire; CMOS inverter, Ch 4-5 
第5週
4/01  Combinational logic, ch 6 
第6週
4/08  Sequential logic, ch 7 
第7週
4/15  Product implementation strategies; interconnect, ch 8-9 
第8週
4/22  校定Midterm exam week 
第9週
4/29  Timing issues, ch 10 
第10週
5/06  Datapath structures, ch 11 
第11週
5/13  Memory/Array structures, ch 12 
第12週
5/20  Introduction, Design for testability, VLSI Ch 1-2 
第13週
5/27  Automatic test pattern generation fundamentals. VLSI Ch 4 
第14週
6/03  Product failure diagnosis fundamentals, VLSI Ch 7-8 
第15週
6/10  Product debug fundamentals, SOC ch 10 
第16週
6/17  Oral presentation of term project and written project due 
第17週
6/24  教師彈性補充教學 
第18週
7/01  教師彈性補充教學