課程名稱 |
薄膜可撓性電子 Thin-Film And Flexible Electronics |
開課學期 |
108-2 |
授課對象 |
電機資訊學院 電子工程學研究所 |
授課教師 |
張子璿 |
課號 |
EEE5055 |
課程識別碼 |
943 U0570 |
班次 |
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學分 |
3.0 |
全/半年 |
半年 |
必/選修 |
選修 |
上課時間 |
星期三2,3,4(9:10~12:10) |
上課地點 |
電二144 |
備註 |
總人數上限:50人 |
Ceiba 課程網頁 |
http://ceiba.ntu.edu.tw/1082EEE5055_ |
課程簡介影片 |
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核心能力與課程規劃關聯圖 |
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課程概述 |
1 Overview of Thin-Film Materials & Flexible Electronics.
-Background and history, emerging technologies, areas of researches, leading groups & companies
2 Properties of the Thin-Film materials: Electrical, Physical, and Optical Characteristic
-nanoelectronics, 2D materials,mechanical, thermal, resonant-cavity, photonic, & plasmonics
3 Preparation of the Thin-Film Materials:
-CVD, PVD, MOCVD, MBE, metal-assisted growth, solution & printed-based
4. Characterization of the Thin-Film Materials
- x-ray diffraction, EDS, atomic probe microscopy, profilometer, PL, transient optical measurement
5. Free-standing Thin-Film materials & Flexible Thin-Film Transistors (I)
-selective release & transfer, printing, neutral plan, Comsol modeling, electrical properties
6. Heterogeneous Integration: Contacts and Interfaces to Organic and Inorganic Electronic Devices
-thin-film & organic & soft materials: contact, defects, strain, interface-recombination
7. Flexible Thin-Film Transistors (II) in sensors, energy, and medical applications
-high-performance sensors, LED, solar-cell, and implantable electronics
8. Hybrid Flexible Electronics System & Flexible Chips
-design flexible electronics in system level, integration of different functional elements
9. Project Design
-develop your own applications |
課程目標 |
本課程的目的是介紹晶體薄膜材料獨特的性質以及其在可撓性電子的穿戴性電子及醫療電子的整合跟運用。課程內容會從(一)各種尖端薄膜材料的準備,(二)軟性材料的整合,並且(三)引入可撓式電子元件與所需要整合跨材料、機械、電子三領域的問題與(四)選擇輔助設計軟體得能力,以達到能啟發學生設計下一代商業化可撓性元件的目標。 |
課程要求 |
Pre-Requisite:
Electronics (I),
Grading:
Homework (20%), Midterm (30%), Final (30%), Design Project (20%) |
預期每週課後學習時數 |
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Office Hours |
備註: Time will be scheduled during first week |
指定閱讀 |
待補 |
參考書目 |
教科書: 無,自備講義以及輔助課後閱讀材料
參考書目(無需自備):
1. Cao, Guozhong. Nanostructures & nanomaterials: synthesis, properties & applications. Imperial college press, 2004.
2. Edward Sazonov, Michael R. Neuman (editors), Wearable Sensors: Fundamentals, Implementation and Applications, 2014, Academic Press/Elsevier, ISBN 978-0124186620
3. Cao, Zexian, ed. Thin film growth: physics, materials science and applications. Elsevier, 2011. |
評量方式 (僅供參考) |
No. |
項目 |
百分比 |
說明 |
1. |
Homework |
20% |
Two homework with designs or literature readings |
2. |
Midterm |
30% |
Open book |
3. |
Final |
30% |
Open book |
4. |
Final Design Project |
20% |
Develop, Design, and Present your own Thin-Film/Flexible Applications |
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週次 |
日期 |
單元主題 |
第1週 |
3/4 |
1 Overview of Thin-Film Materials & Flexible Electronics.
-Background and history, emerging technologies, areas of researches, leading groups & companies |
第2週 |
3/11 |
2-1 Properties of the Organic Materials |
第3週 |
3/18 |
2-2 Properties of the Thin-Film materials: Electrical, Physical, and Optical Characteristic
-nanoelectronics, 2D materials,mechanical, thermal, resonant-cavity, photonic, & plasmonics |
第4週 |
3/25 |
2-3 Properties of the Thin-Film materials: Electrical, Physical, and Optical Characteristic
-nanoelectronics, 2D materials,mechanical, thermal, resonant-cavity, photonic, & plasmonics |
第5週 |
3/18 |
3 Preparation of the Thin-Film Materials:
-CVD, PVD, MOCVD, MBE, metal-assisted growth, solution & printed-based |
第6週 |
3/25 |
4-1. Characterization of the Thin-Film Materials
- x-ray diffraction, EDS, atomic probe microscopy, profilometer, PL, transient optical measurement |
第8週 |
4/1 |
Midterm |
第9週 |
4/8 |
5-1. Free-standing Thin-Film materials & Flexible Thin-Film Transistors (I)
-selective release & transfer, printing, neutral plan, Comsol modeling, electrical properties |
第10週 |
4/15 |
5-2. Free-standing Thin-Film materials & Flexible Thin-Film Transistors (I)
-selective release & transfer, printing, neutral plan, Comsol modeling, electrical properties |
第11週 |
4/22 |
6-1. Heterogeneous Integration: Contacts and Interfaces to Organic and Inorganic Electronic Devices
-thin-film & organic & soft materials: contact, defects, strain, interface-recombination |
第12週 |
5/6 |
6-2. Heterogeneous Integration: Contacts and Interfaces to Organic and Inorganic Electronic Devices
-thin-film & organic & soft materials: contact, defects, strain, interface-recombination |
第13週 |
5/13 |
7. Flexible Thin-Film Transistors (II) in sensors, energy, and medical applications
-high-performance sensors, LED, solar-cell, and implantable electronics |
第14週 |
5/20 |
8. Hybrid Flexible Electronics System & Flexible Chips
-design flexible electronics in system level, integration of different functional elements |
第15週 |
5/27 |
9. Biomedical Flexible Electronics: Part II |
第16週 |
6/3 |
Project Discussion |
第17週 |
6/10 |
Final exam(1Hr) & Presentation |
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